Curtis has applied its thin film
skills to the fulfilment of a variety of microelectronic requirements. Often the metallization of such parts imcreases their
ability to withstand mechanical
and thermal stresses or extends their range of applications to meet specific tolerances.
Curtis is also equipped to
perform a variety of metal forming, cutting and finishing operations, depending on customer specifications. A good
example is the fabrication of lead frames for use in dual-line and flat ceramics packages. Other applications include dielectric coatings, chip
carriers and isolation devices